ARTICLEInfluence d’additifs sur le mécanisme de l’électrodéposition du cuivre en milieu acide : étude en courant alternatif.Lucien Bonou, Marielle Eyraud, Souleymane Kologo, Boubié GuelARTICLEVoltametry and EQCM study of copper oxidation in acidic solution in presence of chloride ionsS. Kologo; M. Eyraud; L. Bonou; F. Vacandio; Y. MassianiARTICLEM. Eyraud, S. Kologo, L. Bonou, Y. Massiani Effect of additives on Cu electrodeposits: electrochemical study coupled with EQCM measurements. J Electroceram (2006) 16: 55–63.M. Eyraud; S. Kologo; L. Bonou; Y. Massiani |